Invention Grant
- Patent Title: Semiconductor package information
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Application No.: US17006005Application Date: 2020-08-28
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Publication No.: US11451379B2Publication Date: 2022-09-20
- Inventor: Uwe Haensel
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michelle F. Murray; Charles A. Brill; Frank D. Cimino
- Main IPC: H04L9/08
- IPC: H04L9/08 ; G06F21/73 ; G06V10/98 ; G06V30/413

Abstract:
In examples, a non-transitory computer-readable storage medium stores executable code, which, when executed by a processor, causes the processor to receive a semiconductor package image, the image including semiconductor package surface codes, the codes including a semiconductor package identifier. The executable code causes the processor to transmit at least one of the semiconductor package identifier, the codes, or the image. The executable code causes the processor to receive information associated with the semiconductor package identifier. The executable code causes the processor to output the information via at least one of a display coupled to the processor, a speaker coupled to the processor, or the wireless transceiver.
Public/Granted literature
- US20220069985A1 SEMICONDUCTOR PACKAGE INFORMATION Public/Granted day:2022-03-03
Information query