Invention Grant
- Patent Title: Lead wire for narrow space insertion
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Application No.: US16832527Application Date: 2020-03-27
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Publication No.: US11456087B2Publication Date: 2022-09-27
- Inventor: Kenji Saka , Hikaru Yamakoshi , Takashi Miyazawa
- Applicant: TOTOKU ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOTOKU ELECTRIC CO., LTD.
- Current Assignee: TOTOKU ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2019-068555 20190329
- Main IPC: H01B1/02
- IPC: H01B1/02 ; A61B8/12

Abstract:
To provide a lead wire for narrow space insertion that is easily inserted into an elongated small-diameter pipe or small-diameter tube such as an ultrasonic probe or an electrode catheter. The above-described problem is solved by a lead wire for narrow space insertion including a copper alloy wire having a conductor diameter within a range of 0.015 to 0.18 mm, and an insulating layer provided to an outer periphery of the copper alloy wire. A friction coefficient of an outermost surface layer of the insulating layer is within a range of 0.05 to 0.3, a tensile strength of the lead wire is within a range of 700 to 1,500 MPa, and a conductivity of the copper alloy wire is within a range of 60 to 90% IACS.
Public/Granted literature
- US20200312480A1 Lead Wire for Narrow Space Insertion Public/Granted day:2020-10-01
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