Invention Grant
- Patent Title: Coil component
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Application No.: US16352190Application Date: 2019-03-13
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Publication No.: US11456111B2Publication Date: 2022-09-27
- Inventor: Byung Soo Kang , Ju Hwan Yang , Byeong Cheol Moon , Yong Hui Li
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0078134 20180705
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/32 ; H01F27/28

Abstract:
A coil component includes a body having one surface and another surface opposing each other and a plurality of wall surfaces each connecting the one surface to the other surface of the body. A pair of recesses are disposed in a respective end surface of a pair of opposing end surfaces of the body and each extend to the one surface. A coil portion includes first and second lead-out portions disposed on a surface of an internal insulating layer embedded in the body, and the coil portion is exposed to an internal wall and a bottom surface of each of the pair of recesses. First and second external electrodes are each disposed along the internal wall of a respective recess and along the one surface of the body to be connected to the coil portion, and are spaced apart from each other on the one surface of the body.
Public/Granted literature
- US20200013540A1 COIL COMPONENT Public/Granted day:2020-01-09
Information query