Invention Grant
- Patent Title: Magnetic coils in locally thinned silicon bridges and methods of assembling same
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Application No.: US16474015Application Date: 2017-03-30
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Publication No.: US11456116B2Publication Date: 2022-09-27
- Inventor: Andreas Augustin , Bernd Waidhas , Sonja Koller , Reinhard Mahnkopf , Georg Seidemann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2017/025083 WO 20170330
- International Announcement: WO2018/182630 WO 20181004
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F41/04 ; H01F17/00 ; H01L23/64 ; H01L27/01 ; H01L49/02
Abstract:
A recess in a die backside surface occupies a footprint that accommodates an inductor coil that is formed in metallization above an active surface of the die. Less semiconductive material is therefore close to the inductor coil. A ferromagnetic material is formed in the recess, or a ferromagnetic material is formed on a dielectric layer above the inductor coil. The recess may extend across a die that allows the die to be deflected at the recess.
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