Invention Grant
- Patent Title: Method of processing workpiece
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Application No.: US17017312Application Date: 2020-09-10
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Publication No.: US11456214B2Publication Date: 2022-09-27
- Inventor: Yoshinobu Saito
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JPJP2019-167280 20190913
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/683 ; H01L23/31 ; H01L21/46 ; H01L21/78
Abstract:
A method of processing a workpiece includes a thermosetting step of heating an area of an expandable sheet around a workpiece to a predetermined temperature or higher and thereafter cooling the heated area of the expandable sheet to make the area harder than before the area has been heated, and after the thermosetting step, an expanding step of expanding the area of the expandable sheet around the workpiece in planar directions to divide the workpiece into chips or to increase distances between the adjacent chips.
Public/Granted literature
- US20210082764A1 METHOD OF PROCESSING WORKPIECE Public/Granted day:2021-03-18
Information query
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