Invention Grant
- Patent Title: Integrated circuit structure
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Application No.: US17127701Application Date: 2020-12-18
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Publication No.: US11456228B2Publication Date: 2022-09-27
- Inventor: Jhon-Jhy Liaw
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L29/66 ; H01L29/78 ; H01L23/48 ; H01L27/092 ; H01L29/417 ; H01L21/8238 ; H01L27/12

Abstract:
An IC structure includes first and second semiconductor fins extending along a first direction; first and second gate electrodes respectively extending across channel regions of the first and second semiconductor fins along a second direction perpendicular to the first direction; first and second source/drain contacts extending across source/drain regions of the first and second semiconductor fins, respectively; and first source/drain via over the first source/drain contact, wherein a width of the second source/drain contact measured along the first direction is greater than a diameter of the first source/drain via.
Public/Granted literature
- US20210143079A1 INTEGRATED CIRCUIT STRUCTURE Public/Granted day:2021-05-13
Information query
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