- Patent Title: Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
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Application No.: US16969357Application Date: 2018-04-19
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Publication No.: US11456271B2Publication Date: 2022-09-27
- Inventor: Jun Chiba , Yuki Antoku , Shota Kawano
- Applicant: TANAKA DENSHI KOGYO K.K.
- Applicant Address: JP Saga-ken
- Assignee: TANAKA DENSHI KOGYO K.K.
- Current Assignee: TANAKA DENSHI KOGYO K.K.
- Current Assignee Address: JP Saga-ken
- Agent Manabu Kanesaka
- Priority: JPJP2018-070807 20180402
- International Application: PCT/JP2018/016173 WO 20180419
- International Announcement: WO2019/193770 WO 20191010
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.
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