• Patent Title: Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
  • Application No.: US16969357
    Application Date: 2018-04-19
  • Publication No.: US11456271B2
    Publication Date: 2022-09-27
  • Inventor: Jun ChibaYuki AntokuShota Kawano
  • Applicant: TANAKA DENSHI KOGYO K.K.
  • Applicant Address: JP Saga-ken
  • Assignee: TANAKA DENSHI KOGYO K.K.
  • Current Assignee: TANAKA DENSHI KOGYO K.K.
  • Current Assignee Address: JP Saga-ken
  • Agent Manabu Kanesaka
  • Priority: JPJP2018-070807 20180402
  • International Application: PCT/JP2018/016173 WO 20180419
  • International Announcement: WO2019/193770 WO 20191010
  • Main IPC: H01L23/00
  • IPC: H01L23/00
Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
Abstract:
A noble metal-coated silver bonding wire suppresses corrosion at the bonding interface under severe conditions of high temperature and high humidity, and the noble metal-coated silver bonding wire can be ball-bonded in the air. The noble metal-coated silver wire for ball bonding is a noble metal-coated silver wire including a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes a palladium intermediate layer and a gold skin layer, the palladium content relative to the entire wire is 0.01 mass % or more and 5.0 mass % or less, the gold content relative to the entire wire is 1.0 mass % or more and 6.0 mass % or less, and the sulfur group element content relative to the entire wire is 0.1 mass ppm or more and 100 mass ppm or less.
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