Invention Grant
- Patent Title: Fuse array structure
-
Application No.: US16667104Application Date: 2019-10-29
-
Publication No.: US11456303B2Publication Date: 2022-09-27
- Inventor: Shian-Jyh Lin
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/108

Abstract:
A semiconductor structure includes a substrate including a substrate including a first surface, a first doped region disposed under the first surface, a second doped region disposed under the first surface, and a recess indented into the substrate and disposed between the first doped region and the second doped region; a control gate structure disposed over the first doped region and electrically connected to a control bit line; a fuse gate structure disposed over the second doped region and electrically connected to a fuse bit line; and a buried word to line disposed between the control gate structure and the fuse gate structure, wherein the buried word line is disposed within the recess of the substrate.
Public/Granted literature
- US20200212049A1 FUSE ARRAY STRUCTURE Public/Granted day:2020-07-02
Information query
IPC分类: