Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16861710Application Date: 2020-04-29
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Publication No.: US11456373B2Publication Date: 2022-09-27
- Inventor: Chia-Ling Chan , Liang-Yin Chen , Wei-Ting Chien
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L29/66 ; H01L29/78 ; H01L21/308 ; H01L21/02 ; H01L21/306 ; H01L21/265

Abstract:
In an embodiment, a device includes: a fin on a substrate, fin having a Si portion proximate the substrate and a SiGe portion distal the substrate; a gate stack over a channel region of the fin; a source/drain region adjacent the gate stack; a first doped region in the SiGe portion of the fin, the first doped region disposed between the channel region and the source/drain region, the first doped region having a uniform concentration of a dopant; and a second doped region in the SiGe portion of the fin, the second doped region disposed under the source/drain region, the second doped region having a graded concentration of the dopant decreasing in a direction extending from a top of the fin to a bottom of the fin.
Public/Granted literature
- US20200259001A1 Semiconductor Device and Method Public/Granted day:2020-08-13
Information query
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