Invention Grant
- Patent Title: Method of manufacturing a microelectronic device having an array of inclined reliefs
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Application No.: US16951357Application Date: 2020-11-18
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Publication No.: US11456403B2Publication Date: 2022-09-27
- Inventor: Stefan Landis , Hubert Teyssedre
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1912857 20191118
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G02B5/18 ; H01L33/58 ; H01L31/0232 ; H01L31/18

Abstract:
A method is provided for producing a microelectronic device having a subsequent grating of reliefs of which at least one wall is slanted, the method including providing a structure including a base, and an initial grating of reliefs, each relief having at least one proximal end in contact with the base, a distal end, and at least one wall extending between the proximal end and the distal end; and laying the reliefs of the initial grating on one another, by application of at least one stress on the structure, such that walls facing two adjacent reliefs come into contact, thus generating at least one subsequent grating of reliefs of which at least one wall is slanted.
Public/Granted literature
- US20210217937A1 METHOD OF MANUFACTURING A MICROELECTRONIC DEVICE HAVING AN ARRAY OF INCLINED RELIEFS Public/Granted day:2021-07-15
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