Invention Grant
- Patent Title: Silicon bulk thermoelectric conversion material
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Application No.: US16957642Application Date: 2018-12-26
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Publication No.: US11456406B2Publication Date: 2022-09-27
- Inventor: Junichiro Shiomi , Makoto Kashiwagi , Takashi Kodama
- Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Applicant Address: JP Kawaguchi
- Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
- Current Assignee Address: JP Kawaguchi
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JPJP2017-249463 20171226
- International Application: PCT/JP2018/047940 WO 20181226
- International Announcement: WO2019/131795 WO 20190704
- Main IPC: H01L35/22
- IPC: H01L35/22 ; H01L35/34 ; C01B33/02 ; B22F1/00 ; B22F1/054

Abstract:
Provided is a silicon bulk thermoelectric conversion material in which thermoelectric performance is improved by reducing the thermal conductivity as compared with the prior art. In the silicon bulk thermoelectric conversion material, the ZT is greater than 0.2 at room temperature with the elemental silicon. In the silicon bulk thermoelectric conversion material, a plurality of silicon grains have an average of 1 nm or more and 300 nm or less, a first hole have an average of 1 nm or more and 30 nm or less present in the plurality of silicon grains and surfaces of the silicon grains, and a second hole have an average of 100 nm or more and 300 nm or less present between the plurality of silicon grains, wherein the aspect ratio of a crystalline silicon grain is less than 10.
Public/Granted literature
- US20210057626A1 SILICON BULK THERMOELECTRIC CONVERSION MATERIAL Public/Granted day:2021-02-25
Information query
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