Invention Grant
- Patent Title: Micro-vibration sensor and preparation method thereof
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Application No.: US16771190Application Date: 2019-10-31
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Publication No.: US11456409B2Publication Date: 2022-09-27
- Inventor: Zhiwu Han , Kejun Wang , Honglie Song , Junqiu Zhang , Daobing Chen , Linpeng Liu , Binjie Zhang , Tao Sun , Dakai Wang , Changchao Zhang
- Applicant: JILIN UNIVERSITY
- Applicant Address: CN Jilin
- Assignee: JILIN UNIVERSITY
- Current Assignee: JILIN UNIVERSITY
- Current Assignee Address: CN Jilin
- Agency: Maier & Maier, PLLC
- Priority: CN201811326680.0 20181108
- International Application: PCT/CN2019/114585 WO 20191031
- International Announcement: WO2020/093921 WO 20200514
- Main IPC: H01L41/312
- IPC: H01L41/312 ; G01H11/08 ; H01L41/297

Abstract:
A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
Public/Granted literature
- US20210175411A1 MICRO-VIBRATION SENSOR AND PREPARATION METHOD THEREOF Public/Granted day:2021-06-10
Information query
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