Invention Grant
- Patent Title: Shield printed wiring board and method of manufacturing shield printed wiring board
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Application No.: US17312060Application Date: 2019-12-12
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Publication No.: US11457527B2Publication Date: 2022-09-27
- Inventor: Yuusuke Haruna , Shirou Yamauchi , Hiroshi Tajima , Sougo Ishioka
- Applicant: Tatsuta Electric Wire & Cable Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
- Current Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: United IP Counselors, LLC
- Agent Kenneth Fagin
- Priority: JPJP2018-232930 20181212
- International Application: PCT/JP2019/048648 WO 20191212
- International Announcement: WO2020/122166 WO 20200618
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/00

Abstract:
Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.
Public/Granted literature
- US20220030699A1 Shield Printed Wiring Board and Method of Manufacturing Shield Printed Wiring Board Public/Granted day:2022-01-27
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