Invention Grant
- Patent Title: Power supply apparatus
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Application No.: US17144746Application Date: 2021-01-08
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Publication No.: US11457533B2Publication Date: 2022-09-27
- Inventor: Akihiko Hirokawa
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-011652 20200128
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K1/18

Abstract:
A power supply apparatus includes a board including a major surface on which a circuit element is mounted, and a case. The case includes a cover portion located at a distance from the board and covering the major surface of the board, and a plurality of leg portions extending from the cover portion toward the board, the case being attached to the board by the leg portions. The leg portions of the case include corner-attachable leg portions that are engaged with corner portions of the board.
Public/Granted literature
- US20210235591A1 POWER SUPPLY APPARATUS Public/Granted day:2021-07-29
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