Invention Grant
- Patent Title: Resin powder and method of manufacturing solid freeform fabrication object
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Application No.: US16563590Application Date: 2019-09-06
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Publication No.: US11458676B2Publication Date: 2022-10-04
- Inventor: Kiichi Kamoda , Akira Saito , Yasutomo Aman , Hitoshi Iwatsuki
- Applicant: RICOH COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: RICOH COMPANY, LTD.
- Current Assignee: RICOH COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Grüneberg and Myers PLLC
- Priority: JPJP2018-167696 20180907,JPJP2019-158102 20190830,JPJP2019-162395 20190905
- Main IPC: B29C64/153
- IPC: B29C64/153 ; B33Y70/00 ; B33Y10/00 ; B29K101/12 ; B29K105/00
Abstract:
A resin powder contains a resin contains columnar particles, wherein the proportion of the columnar particles having a ratio (L/W) of less than 1 is 50 percent by volume or more in the total volume of the resin powder, where W represents the width in the radial direction of the columnar particles and L represents the length in the axis direction of the columnar particles.
Information query
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