Invention Grant
- Patent Title: Automated fiber bundle placement apparatus
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Application No.: US17357263Application Date: 2021-06-24
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Publication No.: US11458695B2Publication Date: 2022-10-04
- Inventor: Takeshi Ataka , Shota Tonoki
- Applicant: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Ishikawa-ken
- Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Ishikawa-ken
- Agency: Paratus Law Group, PLLC
- Priority: JPJP2020-125326 20200722
- Main IPC: B29C70/38
- IPC: B29C70/38 ; B29C70/54

Abstract:
An automated fiber bundle placement apparatus including a placing head configured to place each of fiber bundles onto a placement die and including a plurality of conveying mechanisms each configured to convey the fiber bundle toward a pressing part configured to press the fiber bundles onto the placement die, a plurality of guidance mechanisms each including a guide roller for guiding the fiber bundle toward the conveying mechanism, and a frame attached to a multi-jointed robot configured to move the placing head and provided with the conveying mechanisms and the guidance mechanisms. The frame is constituted by a main frame part provided with the conveying mechanisms and attached to the multi-jointed robot and a sub-frame part provided with the guidance mechanisms and detachably attached to the main frame part.
Public/Granted literature
- US20220024157A1 AUTOMATED FIBER BUNDLE PLACEMENT APPARATUS Public/Granted day:2022-01-27
Information query
IPC分类: