Invention Grant
- Patent Title: Systems and methods for die transfer
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Application No.: US17087216Application Date: 2020-11-02
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Publication No.: US11459190B2Publication Date: 2022-10-04
- Inventor: Tsung-Sheng Kuo , Chih-Hung Huang , Yi-Fam Shiu , Chueng-Jen Wang , Hsuan Lee , Jiun-Rong Pai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B65G47/86
- IPC: B65G47/86 ; B65G15/28

Abstract:
In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
Public/Granted literature
- US20210078809A1 SYSTEMS AND METHODS FOR DIE TRANSFER Public/Granted day:2021-03-18
Information query
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