Invention Grant
- Patent Title: Automated fiber bundle placement apparatus
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Application No.: US17162940Application Date: 2021-01-29
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Publication No.: US11459191B2Publication Date: 2022-10-04
- Inventor: Takeshi Ataka
- Applicant: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Ishikawa-ken
- Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Ishikawa-ken
- Agency: Paratus Law Group, PLLC
- Priority: JPJP2020-032731 20200228,JPJP2020-160322 20200925
- Main IPC: B29C70/38
- IPC: B29C70/38 ; B65G47/90 ; B29C53/80

Abstract:
An automated fiber bundle placement apparatus includes a supply device, a placement head, and an articulated robot. The articulated robot includes a head swing mechanism and a guide mechanism. The guide mechanism includes a position changing mechanism which includes a support member for supporting a tow guide, and which displaces the tow guide corresponding to a change in a position of an introduction section by a head swing mechanism.
Public/Granted literature
- US20210269256A1 AUTOMATED FIBER BUNDLE PLACEMENT APPARATUS Public/Granted day:2021-09-02
Information query
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