Invention Grant
- Patent Title: Thermoplastic resin composition for plating
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Application No.: US16958177Application Date: 2018-12-31
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Publication No.: US11459456B2Publication Date: 2022-10-04
- Inventor: Kyoung Ju Kim , Kee Hae Kwon , Myung Hun Kim , Jung Woo Park
- Applicant: LOTTE CHEMICAL CORPORATION
- Applicant Address: KR Seoul
- Assignee: LOTTE CHEMICAL CORPORATION
- Current Assignee: LOTTE CHEMICAL CORPORATION
- Current Assignee Address: KR Seoul
- Agency: Additon, Pendleton & Witherspoon, P.A.
- Priority: KR10-2017-0185028 20171231
- International Application: PCT/KR2018/016968 WO 20181231
- International Announcement: WO2019/132628 WO 20190704
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08L51/00 ; C08L51/06

Abstract:
A thermoplastic resin composition for plating of the present invention comprises: about 35 wt % to about 60 wt % of a polycarbonate resin; about 1 wt % to about 20 wt % of a first rubber modified vinyl graft copolymer; about 5 wt % to about 30 wt % of a second rubber modified vinyl graft copolymer; and about 25 wt % to about 50 wt % of an aromatic vinyl copolymer resin, wherein the first rubber modified aromatic vinyl graft copolymer and the second rubber modified aromatic vinyl graft copolymer are present in a weight ratio of about 1:1 to about 1:10. The thermoplastic resin composition for plating and a plated molded product comprising the same have good etching property, plating adhesion, impact resistance, heat resistance and the like.
Public/Granted literature
- US20200369877A1 Thermoplastic Resin Composition for Plating Public/Granted day:2020-11-26
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