Invention Grant
- Patent Title: Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
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Application No.: US16359022Application Date: 2019-03-20
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Publication No.: US11459490B2Publication Date: 2022-10-04
- Inventor: Tianjian Huang , Kristina Thompson , Daniel Waski , John Meccia
- Applicant: HENKEL AG & CO, KGaA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO, KGaA
- Current Assignee: HENKEL AG & CO, KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C09J11/08
- IPC: C09J11/08 ; B32B7/12 ; C09J11/00 ; B32B27/32 ; B32B37/12 ; B32B27/10 ; B32B29/00 ; D21H27/30 ; D21H17/36 ; D21H17/37 ; D21H17/57 ; D21H21/54 ; B32B27/08 ; B32B37/06 ; C09J5/06 ; C09J123/08 ; C09J131/04 ; D21H19/20 ; D21H27/18 ; C08K7/22
Abstract:
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
Public/Granted literature
- US20190218429A1 WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF Public/Granted day:2019-07-18
Information query
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