Invention Grant
- Patent Title: Gas heat pump system
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Application No.: US16626475Application Date: 2018-01-11
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Publication No.: US11460223B2Publication Date: 2022-10-04
- Inventor: Seokpyo Hong
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2017-0080585 20170626
- International Application: PCT/KR2018/000558 WO 20180111
- International Announcement: WO2019/004546 WO 20190103
- Main IPC: F25B41/00
- IPC: F25B41/00 ; F25B1/04 ; F25B30/02 ; F25B41/40 ; F25B41/42 ; F25B9/00 ; F25B27/02

Abstract:
A gas heat pump system including an outdoor unit having a compressor, an outdoor heat exchanger, and an expansion device; an indoor unit having an indoor heat exchanger; a refrigerant pipe to connect the outdoor unit and the indoor unit; an engine to combust mixed fuel in which fuel and air are mixed; a coolant tank to store a coolant; a radiator to emit, to an outside, heat which is transferred from the engine to the coolant; and a coolant pipe to connect the coolant tank and the radiator to allow the coolant to circulate therethrough, whereby the gas heat pump system has a cooling capability between 71 kW and 85 kW, the refrigerant is a mixed refrigerant having at least 50% R32, and the refrigerant pipe is a ductile stainless steel pipe having a delta ferrite matrix structure of 1% or less based on grain area.
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