Invention Grant
- Patent Title: Temperature sensor and device equipped with temperature sensor
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Application No.: US16608865Application Date: 2018-04-18
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Publication No.: US11460353B2Publication Date: 2022-10-04
- Inventor: Takaaki Hirabayashi
- Applicant: SEMITEC Corporation
- Applicant Address: JP Tokyo
- Assignee: SEMITEC Corporation
- Current Assignee: SEMITEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2017-091083 20170501
- International Application: PCT/JP2018/015967 WO 20180418
- International Announcement: WO2018/203475 WO 20181108
- Main IPC: G01K7/22
- IPC: G01K7/22 ; G03G15/20 ; H01C1/142

Abstract:
Provided are: a temperature sensor capable of ensuring reliability and improving thermal responsiveness; and a device equipped with such a temperature sensor. The present invention is provided with: a surface-mounted heat sensitive element (10) having at least a pair of electrode parts (12a), (12b); lead parts (22a), (22b) that are electrically connected to the pair of electrode parts (12a), (12b) by welding; a holder (21) that holds and fixes the lead parts (22a), (22b); and an insulation coating part (23) that insulates at least a portion of the lead parts (22a), (22b) and the heat sensitive element (10). The lead parts (22a), (22b) are tabular metal plates and are formed of a metallic material having a melting point of not more than 1300° C.
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