Invention Grant
- Patent Title: Component analysis method and component analysis device
-
Application No.: US16545104Application Date: 2019-08-20
-
Publication No.: US11460436B2Publication Date: 2022-10-04
- Inventor: Jin Yoshida
- Applicant: ARKRAY, Inc.
- Applicant Address: JP Kyoto
- Assignee: ARKRAY, Inc.
- Current Assignee: ARKRAY, Inc.
- Current Assignee Address: JP Kyoto
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JPJP2018-155960 20180823
- Main IPC: G01N27/447
- IPC: G01N27/447 ; G01N21/25 ; G01N21/31
Abstract:
The present disclosure provides component analysis methods including a measurement process and an analysis process.
Public/Granted literature
- US20200072790A1 Component Analysis Method and Component Analysis Device Public/Granted day:2020-03-05
Information query
