Invention Grant
- Patent Title: Camera module, method of manufacturing the same, and electronic apparatus
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Application No.: US16478336Application Date: 2018-01-17
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Publication No.: US11460712B2Publication Date: 2022-10-04
- Inventor: Takayuki Ogasahara
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JPJP2017-014313 20170130
- International Application: PCT/JP2018/001089 WO 20180117
- International Announcement: WO2018/139280 WO 20180802
- Main IPC: G02B27/58
- IPC: G02B27/58 ; G02B3/00 ; G02B5/20 ; G02B7/09 ; H04N5/357

Abstract:
The present technology relates to a camera module, a method of manufacturing the same, and an electronic apparatus capable of suppressing generation of a ghost or a flare. The camera module includes an image sensor, a lens unit that is provided on a light receiving surface of the image sensor, and at least one refractive index adjustment layer that is formed between the image sensor and the lens unit. The present technology can be applied to, for example, a camera module including a complementary metal oxide semiconductor (CMOS) image sensor.
Public/Granted literature
- US20200004039A1 CAMERA MODULE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2020-01-02
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