Invention Grant
- Patent Title: Photosensitive resin composition, photosensitive dry film, and pattern forming process
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Application No.: US16716821Application Date: 2019-12-17
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Publication No.: US11460774B2Publication Date: 2022-10-04
- Inventor: Yoshinori Hirano , Michihiro Sugo , Satoshi Asai , Takahiro Goi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: WHDA, LLP
- Priority: JPJP2018-237135 20181219
- Main IPC: G03F7/075
- IPC: G03F7/075 ; C08F236/02 ; C09D147/00 ; G03F7/004 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38
Abstract:
A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.
Information query
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