Invention Grant
- Patent Title: Substrate processing device and determination method
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Application No.: US16971866Application Date: 2019-06-20
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Publication No.: US11461136B2Publication Date: 2022-10-04
- Inventor: Ken Watanabe
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2018-126903 20180703
- International Application: PCT/JP2019/024455 WO 20190620
- International Announcement: WO2020/008892 WO 20200109
- Main IPC: G06F9/46
- IPC: G06F9/46 ; G06F9/48

Abstract:
In a substrate processing device, a technique that achieves OR transfer satisfying a specified condition is provided. The substrate processing device includes an identifying unit configured to refer to usage states of a plurality of process modules at process time slots to identify one or more process modules that can execute processes of substrates included in a control job to be processed among process modules that can be used at the process time slots, a calculating unit configured to assign the processes of the substrates to respective process time slots of the one or more process modules identified by the identifying unit to calculate a time duration from a start to an end of the processes of the substrates, and a determining unit configured to determine start timing of starting the processes of the substrates so that the time duration calculated by the calculating unit satisfies a specified condition.
Public/Granted literature
- US20210011763A1 SUBSTRATE PROCESSING DEVICE AND DETERMINATION METHOD Public/Granted day:2021-01-14
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