Invention Grant
- Patent Title: Resistor manufacturing method and resistor
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Application No.: US16771393Application Date: 2018-12-11
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Publication No.: US11462343B2Publication Date: 2022-10-04
- Inventor: Yuichi Abe , Seiji Karasawa , Michio Kubota , Yoji Gomi , Koichi Minowa
- Applicant: KOA CORPORATION
- Applicant Address: JP Nagano
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Nagano
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-237820 20171212
- International Application: PCT/JP2018/045456 WO 20181211
- International Announcement: WO2019/117127 WO 20190620
- Main IPC: H01C1/14
- IPC: H01C1/14 ; H01C1/02 ; H01C17/02

Abstract:
An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.
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