Invention Grant
- Patent Title: Epitaxial silicon wafer, and method for manufacturing epitaxial silicon wafer
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Application No.: US16323438Application Date: 2017-08-07
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Publication No.: US11462409B2Publication Date: 2022-10-04
- Inventor: Naoya Nonaka , Tadashi Kawashima , Katsuya Ookubo
- Applicant: SUMCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUMCO CORPORATION
- Current Assignee: SUMCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2016-157965 20160810
- International Application: PCT/JP2017/028620 WO 20170807
- International Announcement: WO2018/030352 WO 20180215
- Main IPC: H01L21/20
- IPC: H01L21/20 ; C30B29/06 ; C23C16/24 ; H01L21/205 ; H01L21/02 ; H01L29/167

Abstract:
An epitaxial silicon wafer includes: a silicon wafer doped with phosphorus as a dopant and having an electrical resistivity of less than 1.0 m Ω·cm; and an epitaxial film formed on the silicon wafer. The silicon wafer includes: a main surface to which a (100) plane is inclined; and a [100] axis that is perpendicular to the (100) plane and inclined at an angle ranging from 0°30′ to 0°55′ in any direction with respect to an axis perpendicular to the main surface. The epitaxial silicon wafer has at most 1/cm2 of a density of a hillock defect generated thereon.
Public/Granted literature
- US20190181007A1 EPITAXIAL SILICON WAFER, AND METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER Public/Granted day:2019-06-13
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