Invention Grant
- Patent Title: Wafer processing method
-
Application No.: US17064187Application Date: 2020-10-06
-
Publication No.: US11462439B2Publication Date: 2022-10-04
- Inventor: Hironari Ohkubo , Keita Obara , Shinya Honda
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2019-186932 20191010
- Main IPC: H01L21/268
- IPC: H01L21/268 ; H01L21/66 ; H01L21/683 ; H01L23/544 ; H01L21/78 ; G06T7/73 ; G06T7/00
Abstract:
A wafer processing method includes a pattern region detecting step, an evaluation region setting step, and an evaluation region deploying step. The pattern region detecting step is a step of detecting a period and positional information in which a substantially identical image appears in an imaged image and detecting a pattern region corresponding to one period. The evaluation region setting step is a step of detecting a position in which no metallic pattern is formed on planned dividing lines and setting the position as an evaluation region for evaluating quality of a processed groove. The evaluation region deploying step is a step of recording the position of the evaluation region in the pattern region and deploying the evaluation region at similar positions in different pattern regions.
Public/Granted literature
- US20210111075A1 WAFER PROCESSING METHOD Public/Granted day:2021-04-15
Information query
IPC分类:
