The present disclosure provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present disclosure further provides a method of manufacturing the above electronic package.