Invention Grant
- Patent Title: Semiconductor storage device and manufacturing method thereof
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Application No.: US17010751Application Date: 2020-09-02
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Publication No.: US11462555B2Publication Date: 2022-10-04
- Inventor: Shun Matsuoka
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JPJP2020-046846 20200317
- Main IPC: H01L27/11573
- IPC: H01L27/11573 ; H01L27/11582 ; H01L27/1157 ; H01L21/265 ; H01L21/02 ; H01L27/11575

Abstract:
According to one embodiment, a semiconductor storage device includes a first structural body on a semiconductor material. The first structural body having a plurality of first conductive films and a plurality of first insulating films that are alternately stacked. A first columnar body penetrates the first structural body and includes a first epitaxial layer on an end adjacent to the semiconductor material. A second columnar body also penetrates the first structural body and includes a second epitaxial layer on an end adjacent to the semiconductor material. A portion of the second epitaxial layer is doped with boron.
Public/Granted literature
- US20210296355A1 SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-09-23
Information query
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