Invention Grant
- Patent Title: Pixel and associated transfer-gate fabrication method
-
Application No.: US16804671Application Date: 2020-02-28
-
Publication No.: US11462579B2Publication Date: 2022-10-04
- Inventor: Hui Zang , Gang Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop GPM LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L29/423

Abstract:
A method for forming a transfer gate includes (i) forming a dielectric pillar on a surface of a semiconductor substrate and (ii) growing an epitaxial layer on the semiconductor substrate and surrounding the dielectric pillar. The dielectric pillar has a pillar height that exceeds an epitaxial-layer height of the epitaxial layer relative to the surface. The method also includes removing the dielectric pillar to yield a trench in the epitaxial layer. A pixel includes a doped semiconductor substrate having a front surface opposite a back surface. The front surface forms a trench extending a depth zT with respect to the front surface within the doped semiconductor substrate along a direction z perpendicular to the front surface and the back surface. The pixel has a dopant concentration profile, a derivative thereof with respect to direction z being discontinuous at depth zT.
Public/Granted literature
- US20210272994A1 PIXEL AND ASSOCIATED TRANSFER-GATE FABRICATION METHOD Public/Granted day:2021-09-02
Information query
IPC分类: