Invention Grant
- Patent Title: Image sensor packages and related methods
-
Application No.: US16455094Application Date: 2019-06-27
-
Publication No.: US11462580B2Publication Date: 2022-10-04
- Inventor: Oswald L. Skeete , Brian Anthony Vaartstra , Derek Gochnour
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, LTD.
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L21/768 ; H01L21/56 ; H01L23/48 ; H01L23/00 ; G02B3/00

Abstract:
Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.
Information query
IPC分类: