Invention Grant
- Patent Title: Piezoelectric substrate attachment structure and sensor module
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Application No.: US16335513Application Date: 2017-09-22
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Publication No.: US11462673B2Publication Date: 2022-10-04
- Inventor: Mitsunobu Yoshida , Kazuhiro Tanimoto , Masahiko Mitsuzuka
- Applicant: Mitsui Chemicals, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JPJP2016-188600 20160927
- International Application: PCT/JP2017/034392 WO 20170922
- International Announcement: WO2018/062056 WO 20180405
- Main IPC: H01L41/087
- IPC: H01L41/087 ; H01L41/053 ; H01L41/193 ; G01L1/16 ; H01L41/113

Abstract:
A piezoelectric substrate attachment structure including a cable-shaped piezoelectric substrate, a press section provided adjacent to the piezoelectric substrate and pressed from an opposite side from the piezoelectric substrate, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. A ratio Eb/Ea of a Young's modulus Eb of the base section to a Young's modulus Ea of the press section being 10−1 or lower.
Public/Granted literature
- US20190214542A1 PIEZOELECTRIC SUBSTRATE ATTACHMENT STRUCTURE AND SENSOR MODULE Public/Granted day:2019-07-11
Information query
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