Invention Grant
- Patent Title: Modular solderless connector integration for conformal phased arrays
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Application No.: US16864719Application Date: 2020-05-01
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Publication No.: US11462869B2Publication Date: 2022-10-04
- Inventor: Anna Stumme , William Mark Dorsey , John A. Valenzi
- Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
- Applicant Address: US VA Arlington
- Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
- Current Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US VA Arlington
- Agency: US Naval Research Laboratory
- Agent Hong-Vinh Nguyen
- Main IPC: H01Q1/08
- IPC: H01Q1/08 ; H01R24/52 ; H01Q1/48 ; H01R13/627 ; H01Q1/36 ; H01Q21/00
Abstract:
A novel, interlocking, snap-fit connection between an antenna aperture and a ground plane layer that contains coaxial connectors is described herein. The snap-fit design provides a simple and solderless transition from the connectors to elements of the antenna aperture. This design facilitates easy assembly and disassembly, allowing parts to be removed, reinstalled and/or reused.
Information query
