Invention Grant
- Patent Title: Cooling mechanism between linear motor rotor and platform coupled thereto
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Application No.: US16430059Application Date: 2019-06-03
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Publication No.: US11462970B2Publication Date: 2022-10-04
- Inventor: Min-Chang Huang , Cheng-Te Chi , Chao-Chin Teng
- Applicant: HIWIN MIKROSYSTEM CORP.
- Applicant Address: TW Taichung
- Assignee: HIWIN MIKROSYSTEM CORP.
- Current Assignee: HIWIN MIKROSYSTEM CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H02K9/19
- IPC: H02K9/19 ; H02K9/00
Abstract:
The present invention provides a cooling mechanism between a linear motor rotor and a platform coupled thereto, characterized essentially in that a cooling portion is provided between the rotor and the platform, and further in that heat transfer is blocked between the cooling portion and the platform, thereby preventing heat received by the cooling portion during heat dissipation from being transferred to the platform, so as to ensure the precision of the platform.
Public/Granted literature
- US20200381980A1 COOLING MECHANISM BETWEEN LINEAR MOTOR ROTOR AND PLATFORM COUPLED THERETO Public/Granted day:2020-12-03
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