Invention Grant
- Patent Title: Radio frequency circuit and communication apparatus
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Application No.: US16832295Application Date: 2020-03-27
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Publication No.: US11463050B2Publication Date: 2022-10-04
- Inventor: Yusuke Naniwa , Hideki Muto , Hiroshi Nishikawa , Takashi Watanabe , Akiko Itabashi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-192117 20170929,JPJP2018-037779 20180302
- Main IPC: H03F3/187
- IPC: H03F3/187 ; H03F3/195 ; H04B1/403 ; H05K1/16

Abstract:
A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.
Public/Granted literature
- US20200228074A1 RADIO FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS Public/Granted day:2020-07-16
Information query
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