Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17204963Application Date: 2021-03-18
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Publication No.: US11463118B2Publication Date: 2022-10-04
- Inventor: Masaki Tada , Isao Takenaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-054222 20200325
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/00

Abstract:
A radio frequency module includes: a plurality of external connection terminals including at least one input terminal and at least one output terminal; at least one power amplifier; at least one low-noise amplifier; a first switch connected between the at least one input terminal and the at least one power amplifier; a second switch connected between the at least one output terminal and the at least one low-noise amplifier; and a module substrate including a first principal surface and a second principal surface on opposite sides of the module substrate. The first switch is disposed on one of the first principal surface and the second principal surface, and the second switch is disposed on the other of the first principal surface and the second principal surface.
Public/Granted literature
- US20210306015A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-09-30
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