Invention Grant
- Patent Title: Printed circuit board including ground line for canceling electromagnetic waves generated by power line, and electronic device including same
-
Application No.: US17261056Application Date: 2019-07-22
-
Publication No.: US11464103B2Publication Date: 2022-10-04
- Inventor: Jaewoong Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2018-0087060 20180726
- International Application: PCT/KR2019/009028 WO 20190722
- International Announcement: WO2020/022722 WO 20200130
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H03H1/00 ; H05K1/11

Abstract:
A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.
Public/Granted literature
Information query