Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US16791897Application Date: 2020-02-14
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Publication No.: US11464113B2Publication Date: 2022-10-04
- Inventor: Jonggyu Lee , Sangyub Kim , Joonhwan Lee , Junho Ahn
- Applicant: LG Magna e-Powertrain Co., Ltd.
- Applicant Address: KR Incheon
- Assignee: LG Magna e-Powertrain Co., Ltd.
- Current Assignee: LG Magna e-Powertrain Co., Ltd.
- Current Assignee Address: KR Incheon
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2019-0017597 20190215,KR10-2019-0076470 20190626
- Main IPC: H05K1/18
- IPC: H05K1/18 ; G01R15/20

Abstract:
A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on one side of the printed circuit board to detect a magnetic field, and a bus bar disposed in contact with another side of the printed circuit board, wherein a thickness between a region of the another side of the printed circuit board, with which the bus bar is in contact, and the one side of the printed circuit board is smaller than a thickness between a remaining region of the another side of the printed circuit board and the one side of the printed circuit board.
Public/Granted literature
- US20200267841A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2020-08-20
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