Invention Grant
- Patent Title: Offset control for assembling an electronic device housing
-
Application No.: US17033117Application Date: 2020-09-25
-
Publication No.: US11464126B2Publication Date: 2022-10-04
- Inventor: David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K7/14 ; H04M1/02 ; H05K5/03 ; G02B7/02 ; H05K5/00 ; G02B13/00 ; B29L31/34 ; H04N5/225
Abstract:
Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
Public/Granted literature
- US20210014996A1 OFFSET CONTROL FOR ASSEMBLING AN ELECTRONIC DEVICE HOUSING Public/Granted day:2021-01-14
Information query
