Provided is a cleaning apparatus for cleaning a portion where a seating pad contacts or a hole into which a pin is inserted when a workpiece is placed. The cleaning apparatus for cleaning a workpiece having a placing portion and a reference hole, including: a table plate, a seating pad on which the workpiece is placed at the placing portion, a first nozzle that ejects a cleaning fluid, a pin inserted into the reference hole, and a second nozzle that ejects the cleaning fluid toward inside of the reference hole.