Invention Grant
- Patent Title: Method for manufacturing busbar and manufacturing busbar through the same
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Application No.: US17106110Application Date: 2020-11-29
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Publication No.: US11465320B2Publication Date: 2022-10-11
- Inventor: Sangyoung Ma
- Applicant: DAE SAN ELECTRONICS CO., LTD.
- Applicant Address: KR Hwaseong-si
- Assignee: DAE SAN ELECTRONICS CO., LTD.
- Current Assignee: DAE SAN ELECTRONICS CO., LTD.
- Current Assignee Address: KR Hwaseong-si
- Agency: Insight Law Group, PLLC
- Agent Seung Lee
- Priority: KR10-2017-0043568 20170404,KR10-2017-0063539 20170523,KR10-2017-0078748 20170621
- Main IPC: H01M50/502
- IPC: H01M50/502 ; H01B13/06 ; B29C45/14 ; H01B7/00 ; B29L31/34

Abstract:
According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.
Public/Granted literature
- US20210078223A1 METHOD FOR MANUFACTURING BUSBAR AND MANUFACTURING BUSBAR THROUGH THE SAME Public/Granted day:2021-03-18
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