Invention Grant
- Patent Title: Fiber-reinforced polymer composition for use in an electronic module
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Application No.: US16190531Application Date: 2018-11-14
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Publication No.: US11466130B2Publication Date: 2022-10-11
- Inventor: Darin Grinsteinner
- Applicant: Ticona LLC
- Applicant Address: US KY Florence
- Assignee: Ticona LLC
- Current Assignee: Ticona LLC
- Current Assignee Address: US KY Florence
- Agency: Dority & Manning, P.A.
- Main IPC: C08J5/24
- IPC: C08J5/24 ; C08J3/22 ; C08K3/04 ; C08K3/08 ; H05K7/20 ; H05K5/03 ; H05K5/00 ; H05K9/00 ; C08K7/02 ; C08J5/10 ; C08J5/04

Abstract:
A fiber-reinforced polymer composition that comprises a polymer matrix; a thermally conductive filler distributed within the polymer matrix; and a plurality of long fibers distributed within the polymer matrix is provided. The long fibers comprise an electrically conductive material and have a length of about 7 millimeters or more. Further, the composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
Public/Granted literature
- US20190153179A1 Fiber-Reinforced Polymer Composition for Use in an Electronic Module Public/Granted day:2019-05-23
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