Invention Grant
- Patent Title: Method of forming a porous multilayer material
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Application No.: US17120576Application Date: 2020-12-14
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Publication No.: US11466358B2Publication Date: 2022-10-11
- Inventor: Jagannathan Rajagopalan
- Applicant: Jagannathan Rajagopalan
- Applicant Address: US AZ Tempe
- Assignee: Jagannathan Rajagopalan
- Current Assignee: Jagannathan Rajagopalan
- Current Assignee Address: US AZ Tempe
- Agency: Fish & Richardson P.C.
- Main IPC: C23C14/16
- IPC: C23C14/16 ; C23C14/58 ; C23C14/30 ; C23C28/02 ; C23C28/00 ; C23C14/34 ; B33Y70/00

Abstract:
Forming a porous multilayer material includes forming a multilayer material on a substrate. Forming the multilayer material includes alternately forming a sacrificial layer and a semi-sacrificial layer, where the sacrificial layer includes a first metal and the semi-sacrificial layer includes the first metal and a second metal or metallic alloy. Forming the porous multilayer material further includes removing at least a portion of the first metal from each of the sacrificial and semi-sacrificial layers to yield the porous multilayer material. The porous multilayer material includes a multiplicity of metal-containing layers, each layer having a thickness in a range between about 5 nm and about 100 nm and bonded to an adjacent layer. Each layer includes chromium, niobium, tantalum, vanadium, molybdenum, tungsten, or a combination thereof. A void is defined between each pair of layers, and a density of porous the multilayer material is
Public/Granted literature
- US20210371969A1 ULTRA-LOW DENSITY METALLIC COATINGS Public/Granted day:2021-12-02
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