A punch assembly for creating clean holes in a wallboard sheet having at least one surface with a face paper layer. The punch assembly includes a frame having a lower assembly configured to support the wallboard sheet, a plate on an upper frame assembly being reciprocable relative to the at least one surface of the wallboard sheet, at least one stripper bushing connected to the plate, where the at least one stripper bushing including a hole and a piercing edge, and at least one punch configured to move through the hole in the at least one stripper bushing. In operation, the plate is moved against the at least one surface of the wallboard sheet so that the piercing edge of the at least one stripper bushing contacts the face paper layer and at least partially cuts the face paper layer prior to the at least one punch moving through the wallboard sheet to form at least one clean hole in the wallboard sheet.