Invention Grant
- Patent Title: Plating chuck
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Application No.: US16644797Application Date: 2017-09-07
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Publication No.: US11469134B2Publication Date: 2022-10-11
- Inventor: Hui Wang , Jian Wang , Zhaowei Jia , Hongchao Yang
- Applicant: ACM Research (Shanghai) Inc.
- Applicant Address: CN Shanghai
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN Shanghai
- Agency: Osha Bergman Watanabe & Burton LLP
- International Application: PCT/CN2017/100814 WO 20170907
- International Announcement: WO2019/047086 WO 20190314
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/673 ; H01L21/288 ; H01L21/285 ; H01L21/445 ; H01L21/479
Abstract:
A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area (3031) and a patterned region (3032) adjacent to the notch area (3031). The plating chuck comprises a cover plate (3033) configured to cover the notch area (3031) of the substrate to shield the electric field at the notch area (3031) when the substrate is being plated.
Public/Granted literature
- US20210066106A1 PLATING CHUCK Public/Granted day:2021-03-04
Information query
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