Invention Grant
- Patent Title: Semiconductor device and a method for fabricating the same
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Application No.: US16995704Application Date: 2020-08-17
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Publication No.: US11469227B2Publication Date: 2022-10-11
- Inventor: Chih-Hao Chang , Wen-Huei Guo , Yi-Shien Mor
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/08 ; H01L21/8234 ; H01L23/485 ; H01L27/02 ; H01L29/417 ; H01L21/768

Abstract:
A semiconductor device includes a first fin field effect transistor (FinFET) and a contact bar (source/drain (S/D) contact layer). The first FinFET includes a first fin structure extending in a first direction, a first gate structure extending in a second direction crossing the first direction, and a first S/D structure. The contact bar is disposed over the first S/D structure and extends in the second direction crossing the first S/D structure in plan view. The contact bar includes a first portion disposed over the first S/D structure and a second portion. The second portion overlaps no fin structure and no S/D structure. A width of the second portion in the first direction is smaller than a width of the first portion in the first direction in plan view.
Public/Granted literature
- US20200381428A1 SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2020-12-03
Information query
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