Invention Grant
- Patent Title: Sensor device and signal processing method
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Application No.: US17272810Application Date: 2019-10-04
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Publication No.: US11470268B2Publication Date: 2022-10-11
- Inventor: Susumu Takatsuka , Hiroki Tetsukawa
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JPJP2018-197497 20181019,JPJP2019-111093 20190614
- International Application: PCT/JP2019/039285 WO 20191004
- International Announcement: WO2020/080141 WO 20200423
- Main IPC: H04N5/341
- IPC: H04N5/341 ; G06K9/62 ; G06V40/10

Abstract:
A sensor device includes an array sensor having a plurality of detection elements arrayed in one or two dimensional manner, a signal processing unit configured to acquire a detection signal by the array sensor and perform signal processing, and a calculation unit. The calculation unit detects an object from the detection signal by the array sensor, and gives an instruction for making a frame rate of the detection signal from the array sensor variable on the basis of the detection of the object.
Public/Granted literature
- US20210258518A1 SENSOR DEVICE AND SIGNAL PROCESSING METHOD Public/Granted day:2021-08-19
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