Invention Grant
- Patent Title: Converter
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Application No.: US16973173Application Date: 2019-04-18
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Publication No.: US11470747B2Publication Date: 2022-10-11
- Inventor: Yun Young Jung
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2018-0070807 20180620,KR10-2018-0083463 20180718
- International Application: PCT/KR2019/004674 WO 20190418
- International Announcement: WO2019/245148 WO 20191226
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K7/14 ; H05K5/02 ; H02M7/00

Abstract:
This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.
Public/Granted literature
- US20210259130A1 CONVERTER Public/Granted day:2021-08-19
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